
The ACS200 Gen3 TE for 200 mm wafers is the further advanced version of the ACS200 Gen3 with higher throughput, future-ready options and operation comfort for advanced packaging applications of tomorrow.
Higher throughput, increased user comfort
Advanced automation, unmatched configuration flexibility: The ACS200 Gen 3 TE combines innovative features and stable processing making it the platform of choice for transferring R&D results into robust high volume manufacturing.
Benchmark for ultimate performance
State-of-the-art technology plus easy handling: the ACS200 Gen3 TE allows for accurate, flexible and robust operations and delivers ultimate throughput.