XBC300 Gen2

XBC300 Gen2 Debonder & Cleaner

The XBC300 Gen2 is a versatile platform for debonding and cleaning at room temperature. Designed for tape-mounted wafers and carriers in 200 mm and 300 mm formats, as well as oversized variants, it enables safe handling of ultra-thin device wafers down to 50 µm or below.  

Your Benefits

With the XBC300 Gen2, you benefit from a highly modular platform built to meet the complex demands ​of advanced packaging, including 2.5D, 3D IC and Fan-out Wafer-level Packaging (FoWLP) wafers, for power devices, as well as for handling fragile substrates like compound semiconductors and MEMS wafers.

Designed to grow with your needs: The modular architecture of the XBC300 Gen2 enables seamless scaling from initial process development to high-volume manufacturing. Supporting a large variety of carrier materials and wafer sizes, the system offers process flexibility at any scale.