XBS300 W2W Hybrid Bonding Platform

XBS300 W2W  is designed for automated hybrid bonding and fusion bonding of aligned 200mm and 300mm wafers. The platform supports both wafer-to-wafer (W2W) and collective die-to-wafer (D2W) bonding, offering maximum flexibility for advanced integration processes.

All options in one system

Thanks to its modular design, the XBS300 W2W hybrid bonding platform for 3D stacked memory or 3D SOC is ideally suited for both R&D as well as high-volume production.

The modular design of the XBS300 W2W allows for flexible configuration. Hardware upgrades – such as a temperature control unit, in-situ deflection measurement, or x/y/θ closed-loop stage control – can be easily installed, enabling alignment performance down to 100 nm.