XBS200 Wafer Bonder

XBS200 Wafer Bonder

Maximum flexibility and consistent process results: the universal XBS200 wafer bonder for wafer sizes up to 200 mm is specifically designed for high-volume production of MEMS, LED and 3D advanced packaging. 

The XBS200 delivers high process flexibility across all permanent bonding tasks. Its novel aligned wafer transfer method reduces the complexity of traditional systems while ensuring consistent results and high system availability. 

Sophisticated technology, unmatched versatility: The XBS200 is the ideal wafer bonder for high-quality, high-volume​​​​ production.