XB8 Wafer Bonder

The XB8 combines process flexibility with high bond force. Designed for a wide range of bonding processes, this semi-automated system supports bond stacks with wafer sizes up to 200 mm.

Temperature, chamber pressure, bond force: The XB8 wafer bonder provides high performance and offers full control over all process parameters – making it ideally suited for both R&D as well as volume production in the fields of MEMS, advanced packaging, 3D integration and engineered substrates.

Versatile high-force bonding

Equipped with a configurable bond chamber, the XB8 adapts easily to changing process requirements. Temperature, bond force, and chamber pressure can all be flexibly controlled by a process recipe to meet your specific production needs.