MA300 Gen3 Mask Aligner

The MA300 Gen3 is SUSS’s flagship mask aligner for 200 mm and 300 mm wafers. Built for advanced packaging, it combines sub-micron alignment with flexible topside, bottomside, and infrared options. From TSVs to RDLs and bumping, it delivers high precision and throughput handling thick resist applications beyond stepper capabilities.

Technical precision, ​​effective​​ throughput

The MA300 Gen3 combines cost efficiency, sub-micron precision, and ​high process flexibility​​. Proven proximity lithography, advanced alignment, and automated handling secure yield and productivity for high-volume fabs as well as demanding R&D environments. 

Engineered for advanced packaging, the MA300 Gen3 delivers its performance through DirectAlign^® accuracy, MO Exposure Optics^®, and flexible alignment modes. With robust thick-resist capability, it provides the technical foundation for stable, reproducible results across a wide process spectrum.