DSC300 Gen3

DSC300 Gen3 Projection Scanner

The DSC300 Gen3 is SUSS’s fully automated, high-throughput solution for projection lithography in advanced packaging on 300 and 200mm wafers. Featuring proprietary scanning technologies, it combines elevated performance, cost efficiency, and high process versatility.

Projection lithography for advanced packaging

Full-field exposure and proprietary scanning provide precise pattern transfer and consistent process results. Adjustable optics and configurations support a wide range of advanced packaging applications, offering a cost-effective alternative to stepper-based lithography.

Engineered for advanced packaging applications

Built on advanced Wynne-Dyson optics, the DSC300 Gen3 delivers precise imaging, robust alignment, and flexible substrate handling. This ensures the precision, yield, and adaptability needed for wafer-level packaging, fan-out, and 2.5D/3D integration.