XBC300 Gen2 D2W Wafer Bonder

Increase production capacity, minimize yield losses: XBC300 Gen2 D2W platform is your fully automated solution for sequential die-to-wafer hybrid bonding on 200mm and 300mm substrates. 

Creating bonds you can rely on

The XBC300 Gen2 D2W combines industry-leading precision with maximized throughput and significantly reduced yield losses. The integrated platform includes all process steps—particularly surface activation and die positioning—in a single, fully automated solution.​​ All this in a footprint that’s unmatched in the market. 

Developed in collaboration with our technology partner SET Corporation SA, the XBC300 Gen2 D2W is particularly suited for the needs of R&D lines, research and technology organizations (RTOs), as well as low volume manufacturing (LVM).