SB8 Gen2 Wafer Bonder

Flexible, adaptable, reliable: SB8 Gen2 is a semi-automated universal wafer bonding system, capable of handling wafers up to 200 mm and supporting substrates in various shapes and sizes. 

Easy to scale and supporting a wide range of bonding technologies, the SB8 Gen2 is a flexible platform designed for various applications and process environments. Its application areas include packaging as well as structuring processes in MEMS, LED, advanced packaging, 2.5D integration, and 3D integration. 

Equipped with an adjustable, high performance​ bond chamber, the SB8 Gen2 adapts easily to changing process requirements. Temperature control, bond force, and chamber pressure can be flexibly set to meet your specific production needs.