DB12T Debonder

The DB12T debonder is a state-of-the-art solution for mechanical peel-off debonding at room temperature. The system separates support carriers from tape-mounted wafers as thin as 50 µm or even below. Available tooling options support wafer sizes from 4″ to 12″, as well as various carrier materials such as glass or silicon. 

Thanks to its advanced process control features, the DB12T debonder is perfectly suited for a wide range of thin wafer applications – including power devices, 2.5D interposers, 3D integrated devices, 3D wafer-level packaged MEMS, and fan-out wafer-level packages.

DB12T gives you full control over all relevant debonding parameters – thus minimizing the debond front and maximizing process reliability.