ACS300 Gen2 Automated Coater & Developer     

The ACS300 Gen2 is the fully automated coater/developer platform for 200 and 300 mm wafers. The high-end system supports the entire workflow from pilot lines to high-volume manufacturing, making it the best-in-class choice for sophisticated resist processing, 3D-Integration and wafer level packaging.

The premium all-in-one solution
All coating processes in one platform: the ACS300 Gen2 combines dual wafer size processing and supreme technology for packaging of all substrates with best-in-class uniformity and quality. The modular design and multiple, scalable configuration options make it the ideal investment for both current and future device generations for any production scale.

Your coating platform for tomorrow’s packaging
One cluster for coating, baking, and developing across a wide range of photoresist thicknesses and dielectric materials – all without mechanical changeover. The ACS300 Gen2 delivers unmatched versatility, precision and throughput as the cost-effective processing solution for the advanced packaging market.