XBC300 Gen2 D2W/W2W Hybrid Bonding Platform

The XBC300 Gen2 D2W/W2W is the world’s first hybrid bonding platform that integrates wafer-to-wafer (W2W), collective die-to-wafer (D2W), and sequential D2W bonding in a cluster ​​​​system. Developed in collaboration with our partner SET Corporation SA, it supports substrates ranging from 200 mm to 300 mm and allows for handling dies on tape frame carriers​​​​.

Your versatile​​​​ platform for hybrid wafer bonding

Capable of all hybrid bonding processes, the XBC300 Gen2 D2W/W2W enables advanced 3D stacking applications – from system-on-chip (SoC) to stacked ICs (SICs). Designed for R&D and pilot lines, it provides a reliable, scalable path to high-volume manufacturing through modular process technology​​​​.

Equipped with innovative SUSS technology, the XC300 Gen 2 W2W/D2W sets new standards for advanced semiconductor manufacturing and provides a fully integrated solution for hybrid bonding.