XBS300 temporary bonding platform

SUSS‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300 mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

All options in one system

Thanks to its flexible configuration the XBS300 is able to process all commercially available temporary bonding adhesives.

The modular design of the XBS300 allows for flexible configuration.