MA200 Gen3 Mask Aligner

The MA200 Gen3 is engineered for high-volume automated production of wafers and square substrates up to 200mm. Combining​ ​innovative​ alignment technolog​​ies​​​ with ​intelligent automations​, it’s the system of choice for ​micro-electromechanical systems (​MEMS), radio frequency (RF) and power devices.

High-volume lithography with sub-micron accuracy

Precision, productivity, and flexibility in one tool: MA200 Gen3 features ​innovative technology for high accuracy, while flexible process modes and automation secure yield and efficiency for MEMS, 3D patterning, and advanced packaging applications such as 3D integration, fan-out, bumping, compound semiconductors, and image sensors. 

Engineered for high-volume environments, the MA200 Gen3 combines precision alignment, advanced optics, and versatile handling to deliver stable, reproducible results across diverse lithography and packaging processes.