MA200 Gen3 Mask Aligner
MA200 Gen3 Mask Aligner
The MA200 Gen3 is engineered for high-volume automated production of wafers and square substrates up to 200mm. Combining innovative alignment technologies with intelligent automations, it’s the system of choice for micro-electromechanical systems (MEMS), radio frequency (RF) and power devices.
High-volume lithography with sub-micron accuracy
Precision, productivity, and flexibility in one tool: MA200 Gen3 features innovative technology for high accuracy, while flexible process modes and automation secure yield and efficiency for MEMS, 3D patterning, and advanced packaging applications such as 3D integration, fan-out, bumping, compound semiconductors, and image sensors.
Engineered for high-volume environments, the MA200 Gen3 combines precision alignment, advanced optics, and versatile handling to deliver stable, reproducible results across diverse lithography and packaging processes.